Patent Assignment
Reel/Frame 018269/0897
Assignment of Assignor's Interest
Recorded: 2006-09-05
Pages: 3
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Light Emitting Diode Module with Heat Spreading Plate Between Capping Layer and Phosphor Layer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.