IP Library › Assignment 018269/0919
Patent Assignment
Reel/Frame 018269/0919

Assignment of Assignor's Interest

Recorded: 2006-09-19 Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2006-09-11
LO, HSIN-JUNG
Executed: 2006-09-11
CHOU, CHIU-MING
Executed: 2006-09-11
CHOU, CHIEN-KANG
Executed: 2006-09-11
CHEN, KE-HUNG
Executed: 2006-09-11
Assignee
MEGICA CORPORATION
ROOM 301/ 302, NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Metal Pad or Metal Bump Over Pad Exposed by Passivation Layer
Patent: 8,399,989 →
Application: 11/461,416 →
Publication: US 2007/0026631
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →