Patent Assignment
Reel/Frame 018283/0221
Assignment of Assignor's Interest
Recorded: 2006-09-19
Pages: 5
Assignors
HUA, YAPING
Executed: 2006-08-14
LI, ZONGYA
Executed: 2006-08-14
ZHAO, YANG
Executed: 2006-09-08
Assignee
MEMSIC, INC.
SUITE 202, 800 TURNPIKE STREET, NORTH ANDOVER, MASSACHUSETTS, 01845
Covered Property
(1)
Method of Wafer-Level Packaging Using Low-Aspect Ratio Through-Wafer Holes
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Assignee's State of Incorporation Previously Recorded at Reel: 018283 Frame: 0221. Assignor(S) Hereby Confirms the Assignment.
Jan 9, 2017
From: HUA, YAPING; LI, ZONGYA; ZHAO, YANG
To: MEMSIC, INC.
Reel/Frame 041306/0647 →
Assignment of Assignor's Interest
May 21, 2021
From: MEMSIC INC.
To: MEMSIC SEMICONDUCTOR (TIANJIN) CO., LTD.
Reel/Frame 056308/0918 →