Patent Assignment
Reel/Frame 041306/0647
Corrective Assignment to Correct the Assignee's State of Incorporation Previously Recorded at Reel: 018283 Frame: 0221. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2017-01-09
Pages: 7
Assignors
HUA, YAPING
Executed: 2006-08-14
LI, ZONGYA
Executed: 2006-08-14
ZHAO, YANG
Executed: 2006-09-08
Assignee
MEMSIC, INC.
800 TURNPIKE STREET, SUITE 202, NORTH ANDOVER, MASSACHUSETTS, 01845
Covered Property
(1)
Method of Wafer-Level Packaging Using Low-Aspect Ratio Through-Wafer Holes
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.