Patent Assignment
Reel/Frame 018319/0994
Assignment of Assignor's Interest
Recorded: 2006-09-15
Pages: 4
Assignors
LEUNG, LAP WAI
Executed: 2006-09-05
CHEN, YU-CHIH
Executed: 2006-09-11
SHAM, MAN-LUNG
Executed: 2006-09-05
CHUNG, CHANG-HWA
Executed: 2006-09-05
Assignee
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE COMPANY LIMITED
3RD FLOOR, BUILDING 6, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES, HONG KONG
Covered Property
(1)
Stacked Multi-Chip Package with Emi Shielding