Assignment of Assignor's Interest

Recorded: 2006-09-20 Pages: 2

Assignor

TANAKA, YASUO

Executed: 2006-08-15

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO 105-8460, JAPAN

Covered Property (1)

Method for modifying surface of substrate and method for manufacturing semiconductor device

Application: 11/475,242 →

Publication: US 2007/0020946

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.