Patent Assignment
Reel/Frame 018345/0426
Assignment of Assignor's Interest
Recorded: 2006-09-27
Pages: 3
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO, 103-8272, JAPAN
Covered Property
(1)
Semiconductor Ic-Embedded Substrate and Method for Manufacturing Same