Patent Assignment
Reel/Frame 018354/0722
Assignment of Assignor's Interest
Recorded: 2006-09-26
Pages: 2
Assignor
JEONG, CHUN-SEOK
Executed: 2006-09-21
Assignee
HYNIX SEMICONDUCTOR INC.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, 467-860, KOREA, REPUBLIC OF
Covered Property
(1)
On Die Thermal Sensor of Semiconductor Memory Device and Method Thereof