Patent Assignment
Reel/Frame 018358/0903
Assignment of Assignor's Interest
Recorded: 2006-10-06
Pages: 3
Assignors
KIM, TAE-HUN
Executed: 2006-09-04
BYUN, HAK-KYOON
Executed: 2006-08-29
PARK, SUNG-YONG
Executed: 2006-08-29
KWON, HEUNG-KYU
Executed: 2006-09-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wiring Substrate Having Variously Sized Ball Pads, Semiconductor Package Having the Wiring Substrate, and Stack Package Using the Semiconductor Package