Patent Assignment
Reel/Frame 018359/0095
Assignment of Assignor's Interest
Recorded: 2006-09-28
Pages: 3
Assignors
LEE, DOO-HWAN
Executed: 2006-09-25
YOO, JE-GWANG
Executed: 2006-09-25
KIM, SEUNG-GU
Executed: 2006-09-25
LEE, JAE-KUL
Executed: 2006-09-25
KIM, MOON-IL
Executed: 2006-09-25
KIM, HYUNG-TAE
Executed: 2006-09-25
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Printed Circuit Board and Manufacturing Method Thereof