Patent Assignment
Reel/Frame 018400/0713
Assignment of Assignor's Interest
Recorded: 2006-10-10
Pages: 4
Assignors
CHINDA, AKIRA
Executed: 2006-09-27
MIYAMOTO, NOBUAKI
Executed: 2006-09-27
MITA, MAMORU
Executed: 2006-09-27
Assignees
HITACHI CABLE, LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
MAMORU MITA
3-16-4, TAJIRICHO, HITACHI-SHI, IBARAKI, JAPAN
Covered Property
(1)
Method for Fabricating a Multilayer Wiring Board, Multilayer Wiring Board, and Electronic Device Using the Same