Assignment of Assignor's Interest

Recorded: 2006-10-23 Pages: 4

Assignors

KONRATH, WILLIBALD

Executed: 2006-09-04

SCHMELCHER, HAIKO

Executed: 2006-09-05

SCHOLL, KLAUS

Executed: 2006-09-05

MULLER, ULF

Executed: 2006-09-05

Assignee

TELENT GMBH

GERBERSTRASSE 33, BACKNANG, D-71522, GERMANY

Covered Property (1)

Method for Gluing a Circuit Component to a Circuit Substrate

Application: 10/576,639 →

Publication: US 2007/0157463

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.