Method for gluing a circuit component to a circuit substrate
A circuit component ( 1 ) is glued to the circuit substrate ( 2 ) by the following steps: a) seizing a circuit component ( 1 ) using a grip-per ( 4 ); b) moving the gripper ( 4 ) towards the surface of the circuit substrate ( 2 ) up to a target distance from the surface at which adhesive ( 3 ) applied between the circuit component ( 1 ) and the circuit substrate ( 2 ) is pressed; C) releasing the circuit component ( 1 ) and removing the gripper ( 4 ) from the circuit component ( 1 ); d) turning the gripper ( 4 ) around an axis (A) perpendicular to the surface of the circuit substrate ( 2 ); e) moving the gripper ( 4 ) into the target distance again; and f) removing the gripper ( 4 ) again.
1 - 10 . (canceled)
11 . A method for gluing a circuit component to a circuit substrate comprising:
seizing a circuit component using a gripper;
moving the gripper towards a surface of the circuit substrate a first time to a target distance from the surface at which adhesive applied between the circuit component and the circuit substrate is pressed;
releasing the circuit component and removing the gripper from the circuit component;
turning the gripper around an axis perpendicular to the surface of the circuit substrate;
moving the gripper to the target distance a second time; and
removing the gripper.
12 . The method of claim 11 further comprising when moving the gripper toward the substrate the first time, detecting a counteracting force opposing the movement of the gripper and defining the target distance to be the distance at which the opposing force reaches a predetermined value.
13 . The method of claim 12 further comprising detecting a local coordinate of the target distance the first time and wherein moving the gripper into the target distance a second time comprises moving the gripper to the detected local coordinate.
14 . The method of claim 11 wherein turning the gripper around an axis perpendicular to the surface of the circuit substrate comprises turning the gripper through a turning angle of approximately 180 degrees.
15 . The method of claim 11 further comprising metering the adhesive to yield an adhesive layer of less than 10 mm thickness.
16 . The method of claim 15 wherein the adhesive layer is approximately 5 mm thick.
17 . The method of claim 11 further comprising applying the adhesive in advance to the circuit substrate as a regular pattern of adhesive dots.
18 . The method of claim 17 further comprising applying additional individual adhesive dots closer to a corner of the circuit component than the dots of the regular pattern of adhesive dots.
19 . The method of claim 17 further comprising applying one or more additional dots to a central area of the regular pattern.
20 . The method of claim 11 wherein the gripper includes an abutment surface that abuts against at least two opposite edges of a surface of the circuit component that faces away from the circuit substrate.
21 . The method of claim 11 wherein seizing a circuit component using a gripper comprises placing a suction opening of the gripper over the circuit component to be seized, and creating a vacuum between the suction opening and the circuit component.