Patent Assignment
Reel/Frame 018423/0302
Assignment of Assignor's Interest
Recorded: 2006-10-23
Pages: 5
Assignors
LEE, KYOUNG WOO
Executed: 2006-10-02
KU, JA HUM
Executed: 2006-10-02
PARK, KI CHUL
Executed: 2006-10-02
CHOI, SEUNG MAN
Executed: 2006-10-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO, SUWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Wafer Having Embedded Electroplating Current Paths to Provide Uniform Plating Over Wafer Surface