Termination of Security Interest in Patents (Releases R/F: 016552/0813)

Recorded: 2006-10-27 Received: 2006-10-27 Pages: 5

Assignor

Executed: 2006-10-27

Assignee

TTM ADVANCED CIRCUITS, INC.

234 CASHMAN DRIVE, CHIPPEWA FALLS, WI, 54729, UNITED STATES

Covered Properties (14)

Filling Method

Application: 10/299,128 →

Pcb Support Plate for Pcb via Fill

Application: 10/201,450 →

Pcb Support Plate Method for Pcb via Fill

Application: 10/201,416 →

Hole Filling Using an Etched Hole-Fill Stand-Off

Application: 10/040,118 →

Etched Hole-Fill Stand-Off

Application: 10/039,942 →

Heated Filling Device

Application: 10/026,135 →

Heated Filling Method

Application: 10/026,382 →

Scavenging System

Application: 10/026,338 →

Scavenging Method

Application: 10/026,337 →

Making and Connecting Bus Bars on Solar Cells

Application: 09/993,587 →

Printed Wiring Board with High Density Inner Layer Structure

Application: 09/951,303 →

Protective Layer for Quartz Crucibles Used for Silicon Crystallization

Application: 09/944,790 →

Method of Producing Shaped Bodies of Semiconductor Materials

Application: 09/933,342 →

Release Coating System for Crucibles

Application: 09/827,540 →