Patent Security Agreement

Recorded: 2006-10-27 Received: 2006-10-27 Pages: 7

Assignor

TTM ADVANCED CIRCUITS, INC.

Executed: 2006-10-27

Assignee

UBS AG, STAMFORD BRANCH

677 WASHINGTON BOULEVARD, STAMFORD, CT, 06901, UNITED STATES

Covered Properties (12)

Method for Analyzing Material Density Variations on a Multi-Layer Printed Circuit Board

Application: 10/609,068 →

Filling Method

Application: 10/299,128 →

Pcb Support Plate for Pcb via Fill

Application: 10/201,450 →

Pcb Support Plate Method for Pcb via Fill

Application: 10/201,416 →

Filling Device

Application: 10/180,835 →

Hole Filling Using an Etched Hole-Fill Stand-Off

Application: 10/040,118 →

Etched Hole-Fill Stand-Off

Application: 10/039,942 →

Heated Filling Device

Application: 10/026,135 →

Heated Filling Method

Application: 10/026,382 →

Scavenging System

Application: 10/026,338 →

Scavenging Method

Application: 10/026,337 →

Printed Wiring Board with High Density Inner Layer Structure

Application: 09/951,303 →