Patent Assignment
Reel/Frame 018450/0766
Assignment of Assignor's Interest
Recorded: 2006-10-23
Pages: 4
Assignors
ONISHI, YASUHIRO
Executed: 2006-10-03
HORINO, MASANOBU
Executed: 2006-10-03
OHASHI, KATSUMI
Executed: 2006-10-04
Assignee
OMRON CORPORATION
801 MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO-SHI, KYOTO 600-8530, JAPAN
Covered Property
(1)
Solder Material Test Apparatus, and Method of Controlling the Same