Patent Assignment
Reel/Frame 018496/0698
Assignment of Assignor's Interest
Recorded: 2006-11-02
Pages: 3
Assignors
KANG, MYUNG SAM
Executed: 2006-10-16
OKABE, SHUHICHI
Executed: 2006-10-16
PARK, JUNG HYUN
Executed: 2006-10-16
JUNG, HOE KU
Executed: 2006-10-16
KIM, JI EUN
Executed: 2006-10-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Printed Circuit Board Having Landless via Hole