Patent Assignment
Reel/Frame 018496/0955
Assignment of Assignor's Interest
Recorded: 2006-11-02
Pages: 3
Assignors
SUGIURA, KAZUHIKO
Executed: 2006-10-13
YOKOYAMA, KENICHI
Executed: 2006-10-13
TAMURA, MUNEO
Executed: 2006-10-13
FUJII, TETSUO
Executed: 2006-10-16
ASAI, MAKOTO
Executed: 2006-10-16
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF, 448-8661, JAPAN
Covered Property
(1)
Method for Separating a Semiconductor Substrate into a Plurality of Chips Along with a Cutting Line on the Semiconductor Substrate