Patent Assignment
Reel/Frame 018522/0308
Assignment of Assignor's Interest
Recorded: 2006-11-15
Pages: 3
Assignee
KYUSHU INSTITUTE OF TECHNOLOGY
1-1, SENSUI-CHO, TOBATA-KU, KITAKYUSHU-SHI, FUKUOKA, 804-8550, JAPAN
Covered Property
(1)
Method for Processing Copper Surface, Method for Forming Copper Pattern Wiring and Semiconductor Device Manufactured Using Such Method
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 21, 2013
From: KYUSHU INSTITUTE OF TECHNOLOGY
To: ATWATER VENTURES LIMITED
Reel/Frame 030490/0949 →
Assignment of Assignor's Interest
May 22, 2013
From: ATWATER VENTURES LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030492/0976 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →