Patent Assignment
Reel/Frame 030490/0949
Assignment of Assignor's Interest
Recorded: 2013-05-21
Pages: 11
Assignor
KYUSHU INSTITUTE OF TECHNOLOGY
Executed: 2013-04-26
Assignee
ATWATER VENTURES LIMITED
NEW PROVIDENCE FINANCIAL CENTER, SUITE 1000, EAST BAY STREET, NASSAU, BAHAMAS
Covered Properties
(7)
Method for Processing Copper Surface, Method for Forming Copper Pattern Wiring and Semiconductor Device Manufactured Using Such Method
Packaged Stacked Semiconductor Device and Method for Manufacturing the Same
Packaged Semiconductor Device and Method of Manufacturing the Packaged Semiconductor Device
Method of Manufacturing Semiconductor Device with Electrode for External Connection and Semiconductor Device Obtained by Means of Said Method
Semiconductor Chip Package with Post Electrodes
Electronic Component Used for Wiring and Method for Manufacturing the Same
Method for Manufacturing a Chip-Size Double Side Connection Package
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 15, 2006
From: IZUMI, AKIRA; ISHIHARA, MASAMICHI
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 018522/0308 →
Assignment of Assignor's Interest
Mar 29, 2007
From: ISHIHARA, MASAMICHI; IZUMI, AKIRA
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 019087/0499 →
Assignment of Assignor's Interest
Oct 19, 2007
From: ISHIHARA, MASAMICHI
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 019986/0575 →
Assignment of Assignor's Interest
Oct 28, 2008
From: ISHIHARA, MASAMICHI; UEDA, HIROTAKA
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 021745/0916 →
Assignment of Assignor's Interest
Jul 22, 2010
From: ISHIHARA, MASAMICHI; UEDA, HIROTAKA
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 024726/0791 →
Assignment of Assignor's Interest
Sep 29, 2010
From: ISHIHARA, MASAMICHI; UEDA, HIROTAKA
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 025059/0765 →
Assignment of Assignor's Interest
Nov 5, 2010
From: ISHIHARA, MASAMICHI
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 025319/0151 →
Assignment of Assignor's Interest
May 22, 2013
From: ATWATER VENTURES LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030492/0976 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Certificate of Conversion & Change of Name
Oct 7, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061623/0928 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →