IP Library Assignment 061623/0928
Patent Assignment
Reel/Frame 061623/0928

Certificate of Conversion & Change of Name

Recorded: 2022-10-07 Pages: 5
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Semiconductor Chip Package with Post Electrodes
Patent: 8,110,911 →
Application: 12/864,125 →
Publication: US 2010/0295178
Related Assignments (7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 22, 2010
From: ISHIHARA, MASAMICHI; UEDA, HIROTAKA
To: KYUSHU INSTITUTE OF TECHNOLOGY
Reel/Frame 024726/0791 →
Assignment of Assignor's Interest May 21, 2013
From: KYUSHU INSTITUTE OF TECHNOLOGY
To: ATWATER VENTURES LIMITED
Reel/Frame 030490/0949 →
Assignment of Assignor's Interest May 22, 2013
From: ATWATER VENTURES LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030492/0976 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →