Patent Assignment
Reel/Frame 069087/0330
Change of Name
Recorded: 2024-10-02
Pages: 6
Assignor
INVENSAS LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(68)
Microelectronic Element with Bond Elements to Encapsulation Surface
Multichip Modules and Methods of Fabrication
Multichip modules and methods of fabrication
Multichip Modules and Methods of Fabrication
Embedded wire bond wires
Nanoscale Interconnect Array for Stacked Dies
Nanoscale Interconnect Array for Stacked Dies
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
Embedded Wire Bond Wires for Vertical Integration with Separate Surface Mount and Wire Bond Mounting Surfaces
Embedded Vialess Bridges
Embedded Vialess Bridges
Embedded Vialess Bridges
Correction Die for Wafer/Die Stack
Correction Die for Wafer/Die Stack
Correction Die for Wafer/Die Stack
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Stacked Transmission Line
Stacked Transmission Line
Warpage Balancing in Thin Packages
Warpage Balancing In Thin Packages
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
Deformable Electrical Contacts With Conformable Target Pads
Remote Optical Engine for Virtual Reality or Augmented Reality Headsets
Systems and Methods for Flash Stacking
Patent:
10,290,612 →
Application:
15/993,271 →
Systems and Methods for Flash Stacking
Systems and Methods for Flash Stacking
Systems and Methods for Flash Stacking
Application:
17/217,749 →
Publication:
US US20210225811A1
Connecting Multiple Chips Using an Interconnect Device
Network On Layer Enabled Architectures
Network On Layer Enabled Architectures
Application:
17/577,944 →
Publication:
US US20220139883A1
Active Bridging Apparatus
Symbiotic Network On Layers
Ultrathin layer for forming a capacitive interface between joined Integrated Circuit Components
Ultrathin Layer for Forming a Capacitive Interface Between Joined Integrated Circuit Component
Capacitive Coupling in a Direct-Bonded Interface for Microelectronic Devices
Capacitive Coupling in a Direct-Bonded Interface for Microelectronic Devices
Capacitive Coupling in a Direct-Bonded Interface for Microelectronic Devices
Multiple Plated via Arrays of Different Wire Heights on a Same Substrate
Patent:
49,987 →
Application:
17/725,442 →
Semiconductor Chip Package with Post Electrodes
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-on-package Assembly With Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Package-On-Package Assembly with Wire Bond Vias
Fine Pitch Bva Using Reconstituted Wafer with Area Array Accessible for Testing
Fine Pitch Bva Using Reconstituted Wafer with Area Array Accessible for Testing
Fine Pitch Bva Using Reconstituted Wafer with Area Array Accessible for Testing
Fine Pitch Bva Using Reconstituted Wafer With Area Array Accessible For Testing
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
Application:
18/828,400 →
Publication:
US US20240429100A1
3D-Interconnect
3D-Interconnect
3d-Interconnect
Embedded Organic Interposers for High Bandwidth
Embedded Organic Interposer for High Bandwidth
Techniques for Manufacturing Split-Cell 3D-Nand Memory Devices
Application:
17/362,557 →
Publication:
US US20220005827A1
Region Shielding Within a Package of a Microelectronic Device
Method of Forming a Region Shielding Within a Package of a Microelectronic Device
3D-Interconnect with Electromagnetic Interference ("EMI") Shield and/or Antenna
3D-Interconnect with Electromagnetic Interference ("Emi") Shield and/or Antenna
Application:
18/747,182 →
Publication:
US US20240339418A1
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 6, 2015
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 036273/0332 →
Assignment of Assignor's Interest
Feb 16, 2016
From: PRABHU, ASHOK S.; AWUJOOLA, ABIOLA; ZOHNI, WAEL; SUBIDO, WILLMAR
To: INVENSAS CORPORATION
Reel/Frame 037745/0863 →
Assignment of Assignor's Interest
Feb 22, 2016
From: DELACRUZ, JAVIER A.; AWUJOOLA, ABIOLA; PRABHU, ASHOK S.; LATTIN, CHRISTOPHER W.
To: INVENSAS CORPORATION
Reel/Frame 037788/0660 →
Assignment of Assignor's Interest
Feb 29, 2016
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 037856/0243 →
Assignment of Assignor's Interest
May 5, 2016
From: WANG, LIANG; LEE, BONGSUB; HABA, BELGACEM; LEE, SANGIL
To: INVENSAS CORPORATION
Reel/Frame 038482/0396 →
Assignment of Assignor's Interest
Jun 28, 2016
From: HUANG, SHAOWU; DELACRUZ, JAVIER A.; HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 039029/0312 →
Assignment of Assignor's Interest
Oct 13, 2016
From: HABA, BELGACEM; CRISP, RICHARD DEWITT; ZOHNI, WAEL
To: INVENSAS CORPORATION
Reel/Frame 040007/0193 →
Assignment of Assignor's Interest
Nov 17, 2016
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 040356/0191 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
May 2, 2017
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 042214/0977 →
Assignment of Assignor's Interest
Dec 7, 2017
From: SHEN, HONG; WANG, LIANG; GAO, GUILIAN
To: INVENSAS CORPORATION
Reel/Frame 044330/0420 →
Assignment of Assignor's Interest
Dec 18, 2017
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 044422/0905 →
Assignment of Assignor's Interest
Apr 23, 2018
From: DELACRUZ, JAVIER A.; AWUJOOLA, ABIOLA; PRABHU, ASHOK S.; LATTIN, CHRISTOPHER S.
To: INVENSAS CORPORATION
Reel/Frame 045610/0118 →
Assignment of Assignor's Interest
Sep 20, 2018
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 046925/0650 →
Assignment of Assignor's Interest
Nov 20, 2018
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 047553/0588 →
Assignment of Assignor's Interest
Apr 9, 2019
From: WANG, LIANG; LEE, BONGSUB; HABA, BELGACEM; LEE, SANGIL
To: INVENSAS CORPORATION
Reel/Frame 048831/0744 →
Assignment of Assignor's Interest
Mar 19, 2020
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 052160/0754 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name
Jun 14, 2023
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 063992/0106 →
Assignment of Assignor's Interest
Jun 14, 2023
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 063949/0112 →