IP Library Assignment 063949/0112
Patent Assignment
Reel/Frame 063949/0112

Assignment of Assignor's Interest

Recorded: 2023-06-14 Pages: 3
Assignor
HABA, BELGACEM
Executed: 2016-02-29
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Correction Die for Wafer/Die Stack
Application: 18/107,823 →
Publication: US 2023/0268320
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 14, 2023
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 063992/0106 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →