IP Library › Assignment 063992/0106
Patent Assignment
Reel/Frame 063992/0106

Change of Name

Recorded: 2023-06-14 Pages: 5
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Correction Die for Wafer/Die Stack
Application: 18/107,823 →
Publication: US 2023/0268320
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 14, 2023
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 063949/0112 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →