IP Library Assignment 052160/0754
Patent Assignment
Reel/Frame 052160/0754

Assignment of Assignor's Interest

Recorded: 2020-03-19 Pages: 3
Assignor
HABA, BELGACEM
Executed: 2020-03-19
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Correction Die for Wafer/Die Stack
Application: 16/823,391 →
Publication: US 2020/0219852
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →