IP Library › Assignment 059581/0435
Patent Assignment
Reel/Frame 059581/0435

Certificate of Conversion & Change of Name

Recorded: 2022-04-04 Pages: 8
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (108)
Microelectronic Element with Bond Elements to Encapsulation Surface
Application: 14/027,571 →
Publication: US US20150076714A1
Microelectronic Element with Bond Elements to Encapsulation Surface
Application: 15/286,086 →
Publication: US US20170025390A1
Multi-Layer Substrates Suitable for Interconnection Between Circuit Modules
Patent: 9,583,426 →
Application: 14/533,728 →
Publication: US US20160126174A1
Interconnection Substrates for Interconnection Between Circuit Modules, and Methods of Manufacture
Application: 15/403,679 →
Publication: US US20170125331A1
Interconnection Substrates for Interconnection Between Circuit Modules, and Methods of Manufacture
Application: 16/017,010 →
Publication: US US20180337118A1
Multichip Modules and Methods of Fabrication
Application: 62/046,395 →
Multichip Modules and Methods of Fabrication
Patent: 9,666,559 →
Application: 14/809,036 →
Publication: US US20160071818A1
Multichip modules and methods of fabrication
Application: 15/584,961 →
Publication: US US20170236794A1
Multichip Modules and Methods of Fabrication
Application: 16/196,313 →
Publication: US US20190088607A1
Image Sensor Device with an Optional Embedded Controller
Application: 62/090,788 →
Image Sensor Device
Patent: 9,899,442 →
Application: 14/945,292 →
Publication: US US20160172402A1
Image Sensor Device
Application: 15/875,067 →
Publication: US US20180145105A1
Image Sensor Device
Application: 16/370,747 →
Publication: US US20190229142A1
Image Sensor Device
Application: 16/513,489 →
Publication: US US20190348459A1
Image Sensor Device
Application: 17/353,103 →
Publication: US US20210366970A1
High-Bandwidth Memory Application With Controlled Impedance Loading
Patent: 9,484,080 →
Application: 14/935,705 →
High-Bandwidth Memory Application with Controlled Impedance Loading
Application: 15/337,323 →
Publication: US US20170133081A1
Wire Bond Wires for Interference Shielding
Patent: 9,490,222 →
Application: 14/880,967 →
Wire Bond Wires for Interference Shielding
Patent: 9,812,402 →
Application: 15/344,990 →
Publication: US US20170117231A1
Wire Bond Wires for Interference Shielding
Application: 15/804,122 →
Publication: US US20180061774A1
Wire Bond Wires for Interference Shielding
Application: 16/127,110 →
Publication: US US20190027444A1
Wire Bond Wires for Interference Shielding
Application: 16/715,524 →
Publication: US US20200118939A1
Wire Bond Wires for Interference Shielding
Application: 62/240,443 →
Embedded wire bond wires
Application: 14/993,586 →
Publication: US US20170103968A1
Nanoscale Interconnect Array for Stacked Dies
Application: 15/147,807 →
Publication: US US20170323867A1
Nanoscale Interconnect Array for Stacked Dies
Application: 16/378,921 →
Publication: US US20190237437A1
Vertical integration with separate surface mount and wire bond mounting surfaces
Application: 62/273,145 →
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
Patent: 9,984,992 →
Application: 14/997,774 →
Publication: US US20170194281A1
Embedded Wire Bond Wires for Vertical Integration with Separate Surface Mount and Wire Bond Mounting Surfaces
Application: 15/959,619 →
Publication: US US20180240773A1
DRAM Adjacent Row Disturb Mitigation
Application: 62/244,494 →
DRAM Adjacent Row Disturb Mitigation
Patent: 9,812,185 →
Application: 15/019,788 →
Publication: US US20170117030A1
DRAM Adjacent Row Disturb Mitigation
Application: 15/803,710 →
Publication: US US20180114561A1
Embedded Vialess Bridges
Application: 62/267,273 →
Embedded Vialess Bridges
Patent: 9,852,994 →
Application: 15/354,061 →
Publication: US US20170170121A1
Embedded Vialess Bridges
Application: 15/845,333 →
Publication: US US20180108612A1
Embedded Vialess Bridges
Application: 16/136,635 →
Publication: US US20190019754A1
Correction Die for Wafer/Die Stack
Application: 15/057,083 →
Publication: US US20170250161A1
Correction Die for Wafer/Die Stack
Application: 16/823,391 →
Publication: US US20200219852A1
System and method for providing 3D water assembly with known-good-dies
Application: 62/387,502 →
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Application: 15/152,469 →
Publication: US US20170186730A1
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Application: 15/834,658 →
Publication: US US20180096973A1
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Application: 16/687,498 →
Publication: US US20200091110A1
Stacked Transmission Line
Application: 15/192,549 →
Publication: US US20170374734A1
Stacked Transmission Line
Application: 16/172,271 →
Publication: US US20190069392A1
Warpage Balancing in Thin Packages
Application: 62/372,147 →
Warpage Balancing in Thin Packages
Patent: 9,972,582 →
Application: 15/670,382 →
Publication: US US20180040572A1
Warpage Balancing In Thin Packages
Application: 15/977,905 →
Publication: US US20180261556A1
Wire Bond Wires for Interference Shielding
Application: 62/368,423 →
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
Patent: 9,935,075 →
Application: 15/237,936 →
Publication: US US20180033764A1
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
Application: 15/914,617 →
Publication: US US20180197834A1
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
Application: 16/833,445 →
Publication: US US20200227360A1
Deformable Electrical Contacts with Conformable Target Pads
Application: 62/518,406 →
Deformable Electrical Contacts With Conformable Target Pads
Application: 15/980,894 →
Publication: US US20180359855A1
Interconnect Structures and Methods for Forming Same
Application: 62/564,068 →
Interconnect Structures and Methods for Forming Same
Application: 16/140,995 →
Publication: US US20190096741A1
Interconnect Structures and Methods for Forming Same
Application: 17/517,247 →
Publication: US US20220130714A1
Remote Optical Engine for Virtual Reality or Augmented Reality Headsets
Application: 62/638,519 →
Remote Optical Engine for Virtual Reality or Augmented Reality Headsets
Application: 16/292,705 →
Publication: US US20190272802A1
Remote Optical Engine for Virtual Reality or Augmented Reality Headsets
Application: 17/019,080 →
Publication: US US20200409157A1
Remote Optical Engine for Virtual Reality or Augmented Reality Headsets
Patent: 50,272 →
Application: 17/383,688 →
Multi-Die Module with Low Power Operation
Application: 62/664,728 →
Multi-Die Module with Low Power Operation
Application: 16/397,569 →
Publication: US US20190333550A1
Stretchable Film
Application: 62/636,975 →
Stretchable Film Assembly with Conductive Traces
Application: 16/136,776 →
Publication: US US20190273016A1
Stretchable Film Assembly with Conductive Traces
Application: 17/182,016 →
Publication: US US20210181511A1
Systems and Methods for Flash Stacking
Application: 15/993,271 →
Systems and Methods for Flash Stacking
Application: 16/368,219 →
Publication: US US20190371765A1
Systems and Methods for Flash Stacking
Application: 16/814,175 →
Publication: US US20200212013A1
Systems and Methods for Flash Stacking
Application: 17/217,749 →
Publication: US US20210225811A1
Connecting Multiple Chips Using an Interconnect Device
Application: 62/863,367 →
Connecting Multiple Chips Using an Interconnect Device
Application: 16/905,766 →
Publication: US US20200402913A1
3D Memory Circuit
Application: 62/937,749 →
3D Memory Circuit
Application: 17/098,299 →
Publication: US US20210149586A1
Network on Layer
Application: 62/857,578 →
Network On Layer Enabled Architectures
Application: 16/678,342 →
Publication: US US20200388592A1
Network On Layer Enabled Architectures
Application: 17/577,944 →
Publication: US US20220139883A1
Active Bridging Apparatus
Application: 16/868,701 →
Publication: US US20210351159A1
Symbiotic Network On Layers
Application: 16/842,199 →
Publication: US US20200387471A1
Symbiotic Network On Layers
Application: 17/583,872 →
Publication: US US20220150184A1
Capacitive Coupling of Integrated Circuit Die Components
Application: 62/234,022 →
Ultrathin layer for forming a capacitive interface between joined Integrated Circuit Components
Application: 15/247,705 →
Publication: US US20170092620A1
Ultrathin Layer for Forming a Capacitive Interface Between Joined Integrated Circuit Component
Application: 16/020,654 →
Publication: US US20180366446A1
Capacitive Coupling in a Direct-Bonded Interface for Microelectronic Devices
Application: 16/212,248 →
Publication: US US20190115323A1
Capacitive Coupling in a Direct-Bonded Interface for Microelectronic Devices
Application: 17/074,401 →
Publication: US US20210035954A1
Microelectronic Element with Bond Elements to Encapsulation Surface
Substrates and Methods of Manufacture
Multichip Modules and Methods of Fabrication
Image Sensor Device
High-Bandwidth Memory Application with Controlled Impedance Loading
Wire Bond Wires for Interference Shielding
Embedded Wire Bond Wires
Nanoscale Interconnect Array for Stacked Dies
Embedded Wire Bond Wires for Vertical Integration with Separate Surface Mount and Wire Bond Mounting Surfaces
Dram Adjacent Row Disturb Mitigation
Embedded Vialess Bridges
Correction Die for Wafer/Die Stack
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Stacked Transmission Line
Warpage Balancing in Thin Packages
Deformable Electrical Contacts with Conformable Target Pads
Interconnect Structures and Methods for Forming Same
Multi-Die Module with Low Power Operation
Systems and Methods for Flash Stacking
Connecting Multiple Chips Using an Interconnect Device
Network on Layer Enabled Architectures
Active Bridging Apparatus
Symbiotic Network on Layers
Capacitive Coupling in a Direct-Bonded Interface for Microelectronic Devices
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 2, 2013
From: HABA, BELGACEM; CRISP, RICHARD DEWITT; ZOHNI, WAEL
To: INVENSAS CORPORATION
Reel/Frame 031360/0422 →
Assignment of Assignor's Interest Nov 4, 2014
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 034096/0717 →
Assignment of Assignor's Interest Jan 22, 2015
From: SHEN, HONG; WANG, LIANG; GUEVARA, GABRIEL Z.; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 034792/0148 →
Assignment of Assignor's Interest Feb 11, 2015
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 034943/0121 →
Assignment of Assignor's Interest Aug 6, 2015
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 036273/0332 →
Assignment of Assignor's Interest Oct 30, 2015
From: AWUJOOLA, ABIOLA; SUN, ZHUOWEN; ZOHNI, WAEL; PRABHU, ASHOK S.
To: INVENSAS CORPORATION
Reel/Frame 036927/0158 →
Assignment of Assignor's Interest Nov 9, 2015
From: SUN, ZHUOWEN; CHEN, YONG; BANG, KYONG-MO
To: INVENSAS CORPORATION
Reel/Frame 036992/0620 →
Assignment of Assignor's Interest Nov 18, 2015
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 037077/0660 →
Assignment of Assignor's Interest Oct 13, 2016
From: HABA, BELGACEM; CRISP, RICHARD DEWITT; ZOHNI, WAEL
To: INVENSAS CORPORATION
Reel/Frame 040007/0193 →
Assignment of Assignor's Interest Oct 28, 2016
From: SUN, ZHUOWEN; CHEN, YONG; BANG, KYONG-MO
To: INVENSAS CORPORATION
Reel/Frame 040160/0795 →
Assignment of Assignor's Interest Nov 17, 2016
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 040356/0191 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest Jan 11, 2017
From: SHEN, HONG; WANG, LIANG; GUEVARA, GABRIEL Z.; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 040950/0848 →
Assignment of Assignor's Interest May 2, 2017
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 042214/0977 →
Assignment of Assignor's Interest Dec 18, 2017
From: HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 044422/0905 →
Assignment of Assignor's Interest Jan 19, 2018
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 044663/0843 →
Assignment of Assignor's Interest Jun 25, 2018
From: SHEN, HONG; WANG, LIANG; GUEVARA, GABRIEL Z.; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 046190/0915 →
Assignment of Assignor's Interest Nov 20, 2018
From: WANG, LIANG; KATKAR, RAJESH; SHEN, HONG
To: INVENSAS CORPORATION
Reel/Frame 047553/0588 →
Assignment of Assignor's Interest Mar 29, 2019
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 048746/0702 →
Assignment of Assignor's Interest Jul 16, 2019
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 049769/0346 →
Assignment of Assignor's Interest Jul 17, 2019
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 049773/0823 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest Sep 3, 2021
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 057382/0266 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →