Patent Assignment
Reel/Frame 034792/0148
Assignment of Assignor's Interest
Recorded: 2015-01-22
Pages: 9
Assignors
SHEN, HONG
Executed: 2015-01-07
WANG, LIANG
Executed: 2015-01-07
GUEVARA, GABRIEL Z.
Executed: 2015-01-07
KATKAR, RAJESH
Executed: 2015-01-07
UZOH, CYPRIAN EMEKA
Executed: 2015-01-08
MIRKARIMI, LAURA WILLS
Executed: 2015-01-22
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Layer Substrates Suitable for Interconnection Between Circuit Modules
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →