Symbiotic network on layers
The technology relates to a system on chip (SoC). The SoC may include a plurality of network layers which may assist electrical communications either horizontally or vertically among components from different device layers. In one embodiment, a system on chip (SoC) includes a plurality of network layers, each network layer including one or more routers, and more than one device layers, each of the plurality of network layers respectively bonded to one of the device layers. In another embodiment, a method for forming a system on chip (SoC) includes forming a plurality of network layers in an interconnect, wherein each network layer is bonded to an active surface of a respective device layer in a plurality of device layer.
1. A system on chip (SoC) comprising:
a first network layer;
a second network layer;
a first device layer having a first surface, the first surface being bonded to the first network layer;
a second device layer having a second surface and a third opposite surface, the second surface of the second device layer being bonded to the second network layer and the third opposite surface of the second device layer being bonded to the first network layer; and
a third device layer having a fourth surface bonded to the second network layer,
wherein:
each of the first device layer, the second device layer, and the third device layer includes a set of one or more components;
each set of the one or more components includes a network interface; and
the first network layer and the second network layer are configured to cooperatively route data between the first device layer, the second device layer, and the third device layer.
2. The SoC of claim 1 , wherein the second device layer includes one or more pathways to pass the data between the first network layer and the second network layer.
3. The SoC of claim 1 , wherein of each component in the first, second, and third sets of one or more components connects said component to at least one of the first network layer or second network layer via conductive structures.
4. The SoC of claim 3 , wherein the first network layer includes a first set of one or more routers and the second network layer includes a second set of one or more routers.
5. The SoC of claim 4 , wherein the network interface of each component in the first, second, and third sets of one or more components is connected to at least one router in the first or second sets of one or more routers.
6. The system of claim 5 , wherein the network interface of each component in the first, second, and third sets of one or more components is configured to packetize and depacketize the data.
7. The SoC of claim 5 , wherein first and second sets of one or more routers are configured to route the data between the first device layer, the second device layer, and the third device layer.
8. The SoC of claim 5 , wherein the first set of one or more routers is configured to route the data from a first component in first set of one or more components through the second device layer to the second set of one or more routers in the second network layer.
9. The SoC of claim 8 , wherein the second set of one or more routers in the second network layer is configured to route the data from the first component in the first set of one or more components to a second component in the third set of one or more components in the third device layer.
10. The SoC of claim 8 , wherein route the data from a first component in set of one or more components in the first device layer through the second device layer to the second set of one or more routers in the second network layer includes routing the data around a third component in the second set of one or more components in the second device layer.
11. The SoC of claim 1 , wherein the first network layer includes a first set of one or more routers and the second network layer includes a second set of one or more routers.
12. The SoC of claim 11 , wherein the first and second sets of one or more routers are configured to route the data between the first device layer, the second device layer, and the third device layer.
13. The SoC of claim 1 , wherein the first network layer is configured to control operation of the second network layer.
14. The SoC of claim 1 , wherein the first network layer and the second network layer are configured to operate independently.
15. A system on chip (SoC) comprising:
a memory layer that includes one or more memory segments;
a first network layer;
a second network layer;
a first device layer having a first surface, the first surface being bonded to the first network layer;
a second device layer having a second surface and a third opposite surface, the second surface of the second device layer being bonded to the second network layer and the third opposite surface of the second device layer being bonded to the first network layer;
a third device layer having a fourth surface bonded to the second network layer; and
a third network layer that includes one or more routers, wherein:
the third network layer has a fifth surface bonded to the third device layer and a sixth surface, opposite to the fifth surface, bonded to the memory layer; and
each of the one or more memory segments is connected to at least one of the one or more routers in the third network layer via one or more conductive structures.
16. The SoC of claim 15 , wherein the first network layer, the second network layer, and the third network layer are configured to cooperatively route data between the first device layer, the second device layer, the third device layer, and the memory layer.