Stretchable film assembly with conductive traces
Apparatus and method relating generally to electronics are disclosed. In one such an apparatus, a film assembly has an upper surface and a lower surface opposite the upper surface. A dielectric film of the film assembly has a structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly. Conductive traces of the film assembly conform to the upper surface or the lower surface in or on the dielectric film in the corrugated section.
1. An apparatus for electronics, comprising:
a film assembly having an upper surface and a lower surface opposite the upper surface;
a dielectric film of the film assembly having a conformed structured profile along the upper surface or the lower surface for having alternating ridges and grooves in a corrugated section in an at rest state of the film assembly; and
conductive traces of the film assembly conformably along the upper surface or the lower surface in or on the dielectric film in the corrugated section;
wherein the corrugated section is a first corrugated section having first alternating ridges and grooves, and wherein the dielectric film of the film assembly comprises:
a second corrugated section of the conformed structured profile of the dielectric film along the upper grooves in the at rest state of the film assembly;
a component section of the conformed structured profile of the dielectric film along the upper surface or the lower surface in the at rest state of the film assembly located between the first corrugated section and the second corrugated section;
the conductive traces of the film assembly conformably along the upper surface or the lower surface in or on the dielectric film in both the first corrugated section and the second corrugated section; and
each of the first corrugated section and the second corrugated section comprises the conformed structured profile for stretching the film assembly 1.5 or more times respective lengths of the first corrugated section and the second corrugated section with same tension on the dielectric film as on the conductive traces.
2. The apparatus according to claim 1 , wherein the dielectric film of the film assembly comprises:
a component section of the conformed structured profile of the dielectric film along the upper surface or the lower surface in the at rest state of the film assembly located adjacent to the corrugated section.
3. The apparatus according to claim 1 , wherein the conductive traces extend from the first corrugated section and the second corrugated section into the component section and are configured for interconnection of a microelectronic component.
4. The apparatus according to claim 3 , wherein the component section is configured for interconnection of a microchip or a semiconductor die as the microelectronic component.
5. The apparatus according to claim 4 , wherein the component section comprises a flat surface for receipt of the microchip or the semiconductor die.
6. The apparatus according to claim 1 , wherein a first portion of the conductive traces extend from the first corrugated section and the second corrugated section into the component section and a second portion of the conductive traces extend from the first corrugated section through the component section to the second corrugated section.
7. The apparatus according to claim 1 , wherein the conductive traces extend from the first corrugated section and the second corrugated section into the component section and are configured to provide an electronic component.
8. The apparatus according to claim 1 , wherein the first and the second alternating ridges and grooves of the conformed structured profile-of the first corrugated section and the second corrugated section, respectively, in the at rest state of the film assembly have a transverse orientation perpendicular with respect to a direction of stretch.
9. The apparatus according to claim 1 , wherein the first and the second alternating ridges and grooves of the conformed structured profile of the first corrugated section and the second corrugated section, respectively, in the at rest state of the film assembly have a sinusoidal or sinusoidal-like wave shape.
10. The apparatus according to claim 1 , wherein the first and the second alternating ridges and grooves of the conformed structured profile of the first corrugated section and the second corrugated section, respectively, in the at rest state of the film assembly respectively have first waves and second waves of different heights for non-uniform stretch of the first corrugated section and the second corrugated section.
11. The apparatus according to claim 1 , wherein the first and the second alternating ridges and grooves of the conformed structured profile of the first corrugated section and the second corrugated section, respectively, in the at rest state of the film assembly respectively have first waves and second waves of different curvatures for non-uniform stretch of the first corrugated section and the second corrugated section.
12. The apparatus according to claim 1 , wherein the conductive traces are partially in the dielectric film.