Patent Assignment
Reel/Frame 046190/0915
Assignment of Assignor's Interest
Recorded: 2018-06-25
Pages: 9
Assignors
SHEN, HONG
Executed: 2015-01-07
WANG, LIANG
Executed: 2015-01-07
GUEVARA, GABRIEL Z.
Executed: 2015-01-07
KATKAR, RAJESH
Executed: 2015-01-07
UZOH, CYPRIAN EMEKA
Executed: 2015-01-08
MIRKARIMI, LAURA WILLS
Executed: 2015-01-22
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Interconnection Substrates for Interconnection Between Circuit Modules, and Methods of Manufacture
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →