Patent Assignment
Reel/Frame 048831/0744
Assignment of Assignor's Interest
Recorded: 2019-04-09
Pages: 4
Assignors
WANG, LIANG
Executed: 2016-05-05
LEE, BONGSUB
Executed: 2016-05-05
HABA, BELGACEM
Executed: 2016-05-05
LEE, SANGIL
Executed: 2016-05-05
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Nanoscale Interconnect Array for Stacked Dies
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →