Patent Assignment
Reel/Frame 037788/0660
Assignment of Assignor's Interest
Recorded: 2016-02-22
Pages: 6
Assignors
DELACRUZ, JAVIER A.
Executed: 2016-02-16
AWUJOOLA, ABIOLA
Executed: 2016-02-08
PRABHU, ASHOK S.
Executed: 2016-02-22
LATTIN, CHRISTOPHER W.
Executed: 2016-02-16
SUN, ZHUOWEN
Executed: 2016-02-16
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →