Package-on-package assembly with wire bond vias
A microelectronic package includes a substrate having a first surface. A microelectronic element overlies the first surface. Electrically conductive elements are exposed at the first surface of the substrate, at least some of which are electrically connected to the microelectronic element. The package includes wire bonds having bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. The ends of the wire bonds are defined on tips of the wire bonds, and the wire bonds define respective first diameters between the bases and the tips thereof. The tips have at least one dimension that is smaller than the respective first diameters of the wire bonds. A dielectric encapsulation layer covers portions of the wire bonds, and unencapsulated portions of the wire bonds are defined by portions of the wire bonds, including the ends, are uncovered by the encapsulation layer.
1. A microelectronic package comprising:
a substrate having a first surface;
at least one microelectronic element overlying the first surface;
electrically conductive elements formed within a region of the substrate;
wire bonds having bases bonded to the electrically conductive elements, wherein:
a first end of a first wire bond extends away from a first base of the first wire bond;
a first end of a second wire bond extends away from a first base of the second wire bond;
the first end of the first wire bond comprises a substantially straight portion;
the first end of the second wire bond comprises a second substantially straight portion;
a first middle portion of the first wire bond comprises a bent portion that is bent relative to the substantially straight portion; and
a first middle portion of the second wire bond comprises a second bent portion that is bent relative to the second substantially straight portion; and
a dielectric encapsulation layer covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the dielectric encapsulation layer, wherein:
the dielectric encapsulation layer comprises a second surface opposite the first surface of the substrate; and
a portion of the first end of the first wire bond is at or above the second surface of the dielectric encapsulation layer.
2. The microelectronic package of claim 1 , wherein the second bent portion of the second wire bond is curved in substantially the same direction as the bent portion of the first wire bond.
3. The microelectronic package of claim 1 , wherein:
the bent portion of the first wire bond is located a first distance from the first surface;
the second bent portion of the second wire bond is located a second distance from the first surface; and
the first distance is substantially the same as the second distance.
4. The microelectronic package of claim 3 , wherein the second bent portion of the second wire bond is curved in substantially the same direction as the bent portion of the first wire bond.
5. The microelectronic package of claim 1 , wherein the substantially straight portion of the first wire is substantially perpendicular to the first surface.
6. The microelectronic package of claim 5 , wherein the substantially straight portion of the second wire is substantially perpendicular to the first surface.
7. The microelectronic package of claim 1 , wherein:
the bent portion of the first wire bond is located a first distance from the first base of the first wire bond;
the second bent portion of the second wire bond is located a second distance from the first base of the second wire bond; and
the first distance is substantially the same as the second distance.
8. The microelectronic package of claim 1 , wherein the substantially straight portion of the first wire is substantially perpendicular to the substrate.
9. The microelectronic package of claim 8 , wherein the substantially straight portion of the second wire is substantially perpendicular to the substrate.
10. A microelectronic package comprising:
a substrate;
at least one microelectronic element overlying the substrate;
electrically conductive elements formed within a region of the substrate;
wire bonds having bases bonded to the electrically conductive elements, wherein:
a first end of a first wire bond extends away from a first base of the first wire bond;
a first end of a second wire bond extends away from a first base of the second wire bond;
the first end of the first wire bond comprises a substantially straight portion and a surface;
the surface of the first end of the first wire bond comprises a cross-section of the first wire bond;
the first end of the second wire bond comprises a second substantially straight portion;
a first middle portion of the first wire bond comprises a bent portion that is bent relative to the substantially straight portion; and
a first middle portion of the second wire bond comprises a second bent portion that is bent relative to the second substantially straight portion; and
a dielectric encapsulation layer covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the dielectric encapsulation layer, wherein the dielectric encapsulation layer does not cover the surface of the first end of the first wire bond.
11. The microelectronic package of claim 10 , wherein the second bent portion of the second wire bond is curved in substantially the same direction as the bent portion of the first wire bond.
12. A microelectronic package comprising:
a substrate having a first surface;
at least one microelectronic element overlying the first surface;
electrically conductive elements at the first surface of the substrate;
wire bonds having bases bonded to the electrically conductive elements, wherein:
a first end of a first wire bond extends away from the electrically conductive elements, the first end of the first wire bond having an end surface comprising a cross-section of the first wire bond;
a first end of a second wire bond extends away from the electrically conductive elements;
the first wire bond comprises a substantially straight portion;
the second wire bond comprises a second substantially straight portion;
a first middle portion of the first wire bond comprises a bent portion that is bent relative to the substantially straight portion to a first direction; and
a first middle portion of the second wire bond comprises a second bent portion that is bent relative to the second substantially straight portion to a second direction;
the first direction is different than the second direction; and
a dielectric encapsulation layer covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the dielectric encapsulation layer, wherein the dielectric encapsulation layer does not cover the end surface of the first wire bond.
13. The microelectronic package of claim 12 , wherein the difference between the first direction and the second direction is approximately 90 degrees.
14. The microelectronic package of claim 12 , wherein the difference between the first direction and the second direction is approximately 180 degrees.
15. A microelectronic package comprising:
a substrate having a first surface;
at least one microelectronic element overlying the first surface;
one or more electrically conductive elements at the first surface of the substrate;
wire bonds having bases bonded to the one or more electrically conductive elements, the wire bonds comprising:
a first plurality of wire bonds having first ends extending away from the first surface, the bases of the first plurality of wire bonds having a first pitch, each of the first ends of the first plurality of wire bonds having an end surface comprising a cross-section of a wire bond in the first plurality of wire bonds;
a second plurality of wire bonds having first ends extending away from the first surface, the bases of the second plurality of wire bonds having a second pitch and being disposed in a straight line with the bases of the first plurality of wire bonds, wherein a spacing between the first plurality of wire bonds and the second plurality of wire bonds is larger than either the first pitch or the second pitch; and
a dielectric encapsulation layer covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the dielectric encapsulation layer, wherein the dielectric encapsulation layer does not cover the end surfaces of the first plurality of wire bonds.
16. The microelectronic package of claim 15 , wherein the first pitch is substantially the same as the second pitch.
17. The microelectronic package of claim 15 , wherein at least two bases of the bases of the first plurality of wire bonds are bonded to a first electrically conductive element of the one or more electrically conductive elements.
18. The microelectronic package of claim 15 , wherein at least two bases of the bases of the second plurality of wire bonds are bonded to a first electrically conductive element of the one or more electrically conductive elements.
19. The microelectronic package of claim 15 , wherein:
each of the first ends of the second plurality of wire bonds have an end surface comprising a cross-section of a wire bond in the second plurality of wire bonds; and
the dielectric encapsulation layer does not cover the end surfaces of the second plurality of wire bonds.