Patent Assignment
Reel/Frame 019087/0499
Assignment of Assignor's Interest
Recorded: 2007-03-29
Pages: 3
Assignee
KYUSHU INSTITUTE OF TECHNOLOGY
1-1, SENSUI-CHO, TOBATA-KU, KITAKYUSHU-SHI, FUKUOKA, 804-8550, JAPAN
Covered Property
(1)
Packaged Stacked Semiconductor Device and Method for Manufacturing the Same
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 21, 2013
From: KYUSHU INSTITUTE OF TECHNOLOGY
To: ATWATER VENTURES LIMITED
Reel/Frame 030490/0949 →
Assignment of Assignor's Interest
May 22, 2013
From: ATWATER VENTURES LIMITED
To: INVENSAS CORPORATION
Reel/Frame 030492/0976 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073941/0814 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0745 →