Electronic component used for wiring and method for manufacturing the same
View Patent ↗A wiring electronic component of the present invention is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and in which the circuit element is connected to a wiring pattern on the back face and also connected, via vertical wiring, to external electrodes located on the front face opposite the wiring pattern. The wiring electronic component is composed of an electrically conductive support portion, which serves as an electroforming mother die, and a plurality of vertical wiring portions formed through electroforming such that they are integrally connected to the support portion.
1. A wiring electronic component to be incorporated into an electronic device package in which a circuit element is disposed therein, the circuit element including a semiconductor chip and the electronic device package including vertical wiring connected to the circuit element and external electrodes, the wiring electronic component comprising:
a support portion having a two-layer structure, said two-layer structure having a reinforcement plate bonded to a back side of an insulation material via a separable adhesive; and
a plurality of vertical wiring portions separably connected to the support portion so as to form the vertical wiring.
2. A wiring electronic component according to claim 1 , wherein the plurality of vertical wiring portions are formed on the support portion by means of plating.
3. A wiring electronic component according to claim 2 , wherein horizontal wiring portions connected to the vertical wiring portions are formed.
4. A wiring electronic component according to claim 3 , wherein the support portion is formed by bonding a tape to the entirety of one side of a stainless steel plate, a silicon substrate, or a glass substrate, the tape being formed of the insulation material in the form of thin film.
5. A wiring electronic component according to claim 4 , wherein a seed layer of metal is formed on the insulation material, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
6. A wiring electronic component according to claim 3 , wherein a stainless steel plate, a silicon substrate, or a glass substrate is used as the support portion, a seed layer is formed on the support portion via a separation assisting layer, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
7. A wiring electronic component according to claim 1 , wherein said reinforcement plate is connected to the semiconductor chip in a first state, said reinforcement plate being disconnected from the semiconductor chip in a second state, said insulation material being connected to one or more of said vertical wiring portions in the first state and the second state.
8. A wiring component according to claim 7 , wherein said insulation material and the semiconductor chip define a space in a first wiring electronic component configuration, wherein resin fills said space such that said resin engages said insulation material in the second wiring electronic component configuration.
9. A method of manufacturing a wiring electronic component to be incorporated in an electronic device package in which a circuit element is disposed therein, the circuit element including a semiconductor chip and the electronic device package including external electrodes connected to the circuit element via vertical wiring, the method comprising:
providing a support portion comprising a two-layer structure, said two-layer structure comprising reinforcement plate and insulation material, said reinforcement plate being bonded to a back side of the insulation material via a separable adhesive; and
forming a plurality of vertical wiring portions for the vertical wiring through plating such that the vertical wiring portions are detachably connected to the support portion.
10. A method of manufacturing a wiring electronic component according to claim 9 , wherein, after horizontal wiring portions are formed on the support portion, the vertical wiring portions to be connected to the horizontal wiring portions are formed.
11. A method of manufacturing a wiring electronic component according to claim 10 , wherein a stainless steel plate, a silicon substrate, or a glass substrate is used as the support portion, a seed layer is formed on the support portion via a separation assisting layer, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
12. A method of manufacturing a wiring electronic component according to claim 10 , wherein the support portion is formed by bonding a tape to the entirety of one side of a stainless steel plate, a silicon substrate, or a glass substrate, the tape being formed of said insulation material in the form of thin film.
13. A method of manufacturing a wiring electronic component according to claim 12 , wherein a seed layer of metal is formed on the insulation material, and the vertical wiring portions and the horizontal wiring portions are grown on the seed layer through plating.
14. A method of manufacturing a wiring electronic component according to claim 9 , further comprising:
connecting one or more of the vertical wiring portions to the semiconductor chip with each of the vertical wiring portions connected to the reinforcement plate;
removing said reinforcement plate after said one or more of the vertical wiring portions is connected to the semiconductor chip such that said insulation material remains connected to the semiconductor chip and said one or more of the vertical wiring portions is disconnected from said reinforcement plate.
15. A method of manufacturing a wiring electronic component according to claim 14 , further comprising:
filling a space defined by at least the semiconductor chip and said insulation material with resin prior to removing said reinforcement plate, said resin engaging the semiconductor chip and said insulation material.
16. A method of manufacturing a wiring electronic component, the method comprising:
providing a semiconductor chip;
providing a support portion comprising a reinforcement plate, a separable adhesive and insulation material, said reinforcement plate being detachably connected to a rear side of said insulation material via said separable adhesive;
forming a plurality of vertical wiring portions for vertical wiring via plating such that the vertical wiring portions are detachably connected to the support portion;
connecting said support portion to said semiconductor chip, wherein each of said plurality of vertical wiring portions is connected to said semiconductor chip;
removing said reinforcement plate from said insulation material with each of said plurality of vertical wiring portions connected to said semiconductor chip such that said reinforcement plate is disconnected from said insulation material and each of said plurality of said vertical wiring portions, wherein each of said wiring portions remains connected to said insulation material with said reinforcement plate removed from said insulation material.
17. A method of manufacturing a wiring electronic component according to claim 16 , further comprising:
filling a space defined by at least said semiconductor chip and said insulation material with resin prior to removing said reinforcement plate, said resin engaging the semiconductor chip and said insulation material.
18. A method of manufacturing a wiring electronic component according to claim 17 , further comprising:
forming horizontal wiring portions, each of said horizontal wiring portions engaging one of said vertical wiring portions, said insulation material comprising another side opposite said rear side, each of said horizontal wiring portions engaging said another side, each of said horizontal wiring portions being connected to said semiconductor substrate via one of said vertical wiring portions.