Patent Assignment
Reel/Frame 018530/0266
Assignment of Assignor's Interest
Recorded: 2006-10-16
Pages: 2
Assignors
KURITA, YOICHIRO
Executed: 2006-09-25
SOEJIMA, KOJI
Executed: 2006-09-25
KAWANO, MASAYA
Executed: 2006-09-25
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Method for Manufacturing Semiconductor Module Using Interconnection Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.