Patent Assignment
Reel/Frame 018565/0860
Assignment of Assignor's Interest
Recorded: 2006-11-14
Pages: 2
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF, 448-8661, JAPAN
Covered Property
(1)
Wafer and Wafer Cutting and Dividing Method