Patent Assignment
Reel/Frame 018610/0740
Assignment of Assignor's Interest
Recorded: 2006-11-16
Pages: 3
Assignors
KOMURA, ATSUSHI
Executed: 2006-10-24
TAMURA, MUNEO
Executed: 2006-10-27
SUGIURA, KAZUHIKO
Executed: 2006-10-27
FUNATO, HIROTSUGU
Executed: 2006-10-24
MARUYAMA, YUMI
Executed: 2006-10-27
FUJII, TETSUO
Executed: 2006-10-24
KOHNO, KENJI
Executed: 2006-10-24
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Dicing Method for Semiconductor Substrate