Patent Assignment
Reel/Frame 018614/0402
Assignment of Assignor's Interest
Recorded: 2006-11-14
Pages: 2
Assignor
SONG, IN-JAE
Executed: 2006-11-10
Assignee
SAMSUNG CORNING CO., LTD.
472, SHIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Multi-Freestanding Gan Wafer
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger.
May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
Change of Name
Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
Change of Name
Jan 16, 2015
From: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 034774/0676 →