Patent Assignment
Reel/Frame 018623/0860
Assignment of Assignor's Interest
Recorded: 2006-12-13
Pages: 18
Assignors
RZEPIELA, JEFFREY A.
Executed: 2006-11-20
FENG, YIPING
Executed: 2006-11-14
PEI, SHIYOU
Executed: 2006-10-26
KAGAN, ALEXANDER
Executed: 2006-10-26
SHI, JIANOU
Executed: 2006-11-01
EDELSTEIN, SERGIO
Executed: 2006-12-01
Assignee
KLA-TENCOR TECHNOLOGIES CORPORATION
ONE TECHNOLOGY DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Systems and Methods for Controlling Deposition of a Charge on a Wafer for Measurement of One or More Electrical Properties of the Wafer