Patent Assignment
Reel/Frame 018631/0225
Assignment of Assignor's Interest
Recorded: 2006-12-14
Pages: 3
Assignors
CUI, CHENG QIANG
Executed: 2006-10-14
NG, KAI C
Executed: 2006-10-14
CHEUNG, CHEE WAH
Executed: 2006-10-14
Assignee
COMPASS TECHNOLOGY CO., LTD.
12 SUI LEK YUEN, SUITE 10, 5TH FLOOR, CHIAPHUA CENTRE, SHATIN, HONG KONG
Covered Property
(1)
Die-Up Integrated Circuit Package with Grounded Stiffener