Patent Assignment
Reel/Frame 018639/0319
Assignment of Assignor's Interest
Recorded: 2006-11-27
Pages: 2
Assignors
CHOW, KIN YEAN
Executed: 2006-11-10
FANG, CHING MENG
Executed: 2006-11-10
MANDEL, LARRY M.
Executed: 2006-11-10
YONG, SIM YING
Executed: 2006-11-10
Assignee
DELPHI TECHNOLOGIES, INC.
P.O. BOX 5052, LEGAL STAFF - MAIL CODE : 480-410-202, TROY, MICHIGAN
Covered Property
(1)
Overmolded Electronic Assembly
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 13, 2009
From: DELPHI TECHNOLOGIES, INC.
To: BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT, THE
Reel/Frame 023510/0562 →
Release of Security Interest
Apr 15, 2011
From: THE BANK OF NEW YORK MELLON
To: DELPHI CONNECTION SYSTEMS HOLDINGS LLC; DELPHI PROPERTIES MANAGEMENT LLC; DELPHI TECHNOLOGIES, INC.; DELPHI AUTOMOTIVE SYSTEMS LLC
Reel/Frame 026138/0574 →
Security Agreement
Apr 18, 2011
From: DELPHI TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 026146/0173 →
Release of Security Interest
Jan 14, 2015
From: JPMORGAN CHASE BANK, N.A.
To: DELPHI TECHNOLOGIES, INC.
Reel/Frame 034762/0540 →
Assignment of Assignor's Interest
Jan 23, 2018
From: DELPHI TECHNOLOGIES, INC
To: DELPHI TECHNOLOGIES IP LIMITED
Reel/Frame 045113/0958 →
Change of Name
Sep 18, 2024
From: DELPHI TECHNOLOGIES IP LIMITED
To: BORGWARNER US TECHNOLOGIES LLC
Reel/Frame 068985/0968 →