IP Library Assignment 018644/0007
Patent Assignment
Reel/Frame 018644/0007

Assignment of Assignor's Interest

Recorded: 2006-12-05 Pages: 4
Assignor
HIGUCHI, MINORU
Executed: 2006-11-21
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Semiconductor Wafer and Semiconductor Device, and Method for Manufacturing Same
Patent: 7,615,781 →
Application: 11/633,502 →
Publication: US 2007/0131931
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 5, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025315/0201 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →