Patent Assignment
Reel/Frame 018649/0584
Assignment of Assignor's Interest
Recorded: 2006-12-07
Pages: 2
Assignor
MOCHIDA, AKIRA
Executed: 2006-11-28
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device Having Semiconductor Element, Insulation Substrate and Metal Electrode