Assignment of Assignor's Interest

Recorded: 2006-12-08 Pages: 2

Assignor

HITACHI, LTD.

Executed: 2006-11-24

Assignee

RENESAS TECHNOLOGY CORP.

4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Property (1)

Semiconductor Device, Semiconductor Wafer, Semiconductor Module, and a Method of Manufacturing Semiconductor Device

Patent: 7,217,992 →

Application: 10/861,523 →

Publication: US 2004/0217453

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.