Merger and Change of Name

Recorded: 2010-09-24 Pages: 9

Assignor

RENESAS TECHNOLOGY CORP.

Executed: 2010-04-01

Assignee

RENESAS ELECTRONICS CORPORATION

1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN

Covered Properties (8)

Semiconductor Device, Semiconductor Wafer, Semiconductor Module, and a Method of Manufacturing Semiconductor Device

Patent: 6,888,230 →

Application: 09/429,297 →

Semiconductor Apparatus Having Stress Cushioning Layer

Patent: 6,621,154 →

Application: 09/671,364 →

Semiconductor Devices

Patent: 6,710,263 →

Application: 09/790,978 →

Publication: US 2001/0023983

Semiconducting System and Production Method

Patent: 6,680,540 →

Application: 09/799,533 →

Publication: US 2001/0030366

Semiconductor Device

Patent: 6,791,182 →

Application: 10/103,799 →

Publication: US 2003/0042597

Semiconductor Device Comprising Stress Relaxation Layers and Method for Manufacturing the Same

Patent: 6,710,446 →

Application: 10/136,305 →

Publication: US 2002/0130412

Circuit Tape Having Adhesive Film Semiconductor Device and a Method for Manufacturing the Same

Patent: 7,202,570 →

Application: 10/724,092 →

Publication: US 2004/0224149

Semiconductor Device, Semiconductor Wafer, Semiconductor Module, and a Method of Manufacturing Semiconductor Device

Patent: 7,217,992 →

Application: 10/861,523 →

Publication: US 2004/0217453

Related Assignments (1)

Other recorded transfers of the patents in this record — the chain of ownership.