Patent Assignment
Reel/Frame 018666/0719
Assignment of Assignor's Interest
Recorded: 2006-12-05
Pages: 2
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
High-Temperature Solder, High-Temperature Solder Paste and Power Semiconductor Device Using Same