IP Library › Assignment 018678/0027
Patent Assignment
Reel/Frame 018678/0027

Assignment of Assignor's Interest

Recorded: 2006-12-27 Pages: 2
Assignors
NAKAGAWA, HIDEO
Executed: 2006-05-08
SASAGO, MASARU
Executed: 2006-05-08
MURAKAMI, TOMOYASU
Executed: 2006-05-09
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property (1)
Dry Etching Method, Fine Structure Formation Method, Mold and Mold Fabrication Method
Patent: 7,731,862 →
Application: 11/475,190 →
Publication: US 2007/0187362
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0671 →