Patent Assignment
Reel/Frame 018679/0062
Assignment of Assignor's Interest
Recorded: 2006-12-27
Received: 2006-12-27
Pages: 6
Assignor
NEC CORPORATION
Executed: 2006-11-29
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, JPX, 211-8668, JAPAN
Covered Properties
(4)
Semiconductor Integrated Circuit Device
Application:
10/098,372 →
Method of Fabricating a Semiconductor Device
Application:
10/060,569 →
Semiconductor Memory Device and Method for Replacing Redundancy Circuit
Application:
09/965,199 →
Semiconductor Integrated Circuit Device and Method for Designing the Same
Application:
09/939,870 →